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The Best Adhesive to Use For Bonding Composite Substrates




High-performance industrial adhesive has been widely used in different applications in the construction, transportation, electronics products, sports products, and even biomedical industries. One of the major uses of this adhesive is for assembling composite products because it provides greater strength compared to other bonding materials. Moreover, the adhesive is lightweight, making it a better option for bonding composite joints, especially in working with fewer parts.



The major advantages of using an industrial adhesive include the following:



● Corrosion resistance

● Fatigue resistance

● Efficient load transfer

● Smooth contour



However, there are also a few drawbacks in using this product, which are as follows:



● Limitation in material thickness that can be bonded

● Needs thorough surface preparation

● Residual stress if not cured properly



Designing and formulating industrial adhesive


Depending on the desired mechanical qualities of the adhesive, the raw materials to be used in designing and formulating it must be carefully considered. The resin chemistry of the adhesive should be determined at first whether it must be acrylate, epoxy, or any other materials to suit the substrate materials it will bind. In order to achieve the intended strength required by the application, there are some crucial factors to also take into account. These steps include:



- Cleaning the surfaces first of any dirt, dust, grease, and other debris

- Abrading the substrate to be bonded

- Using the right industrial adhesive for the job

- Providing enough clamping pressure along the bonded parts until they fully cured.



The amount of time needed to manufacture the final composite product can be reduced by using the right method and technologies. This can significantly eliminate the need to prefabricate the product to achieve desired properties. All thanks to the effective use of industrial adhesive that can provide those amazing benefits with proper preparation steps and bond applications.

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